Large-scale programmable assembly of functional micro-components for advanced electronics via light-regulated adhesion and polymer growth

Abstract Large-area, programmable assembly of diverse micro-objects onto arbitrary substrates is a fundamental yet challenging task. Herein simple wafer-level micro-assembly technique based on the light-triggered change in both surface topography and interfacial adhesion soft photo-sensitive polymer proposed. In particular, light-regulated growth creates locally indented elevated zones stamp surface. The light-mediated reduction, other hand, facilitates inks to be released from polymer. interplay these two effects makes it feasible for ultra-small components various coated with supplementary adhesive layers. fidelity this validated by assembling materials functional devices, printing size up 4-inch. This work provides rational strategy large-scale delicate micro-objects, bypassing common issues some existing techniques such as poor transfer uniformity, small area, high cost.